The author graduated the Faculty of Physics at University of Bucharest in 1995 and received his PhD from the Institute of Atomic Physics Bucharest, Romania, in 2000.
After working in National Institute of Materials Physics, Bucharest and in Max Planck of Microstructure Physics Halle (Saale), Germany, he joined EV Group in 2001 as a wafer bonding technology process engineer and product manager for fusion wafer bonding equipment. His activities were focusing since then on process development based on wafer bonding with applications in MEMS and 3D integration.
He is currently Chief Scientist for permanent wafer bonding and the manager of the Technology Development team at EV Group headquarters in Austria. He is author and co-author of over 150 papers published in journals, proceedings volumes and book chapters.