平行论坛2：化合物半导体核心装备

平行论坛2：化合物半导体核心装备

Parallel Forum 2: Core Equipment of Compound Semiconductors

时间：2024年4月10日 09:00-17:35 & 11日09:00-12:00

Time: April 10, 2024 09:00-18:00 & April 11, 2024 09:00-12:00

地点：中国武汉光谷科技会展中心 • 三层 • 多功能厅2

Location: China Optics Valley Convention & Exhibition Center • 3rd Floor • Multi-Function Hall 2

4月10日 / April 10

09:00-09:25

刻蚀-沉积一体化赋能化合物半导体功率器件的大规模制造

Integrated Etch & Deposition Solutions Enabling Compound Semiconductor Power Devices HVM

郭春祥——江苏鲁汶仪器股份有限公司8英寸刻蚀工艺主管

GUO Chunxiang——8-Inch Etching Process Supervisor of LEUVEN Instruments Limited

09:25-09:50

黄光湿法制程设备在新型电子器件领域的创新应用

Innovative applications of photography and wet-process equipment in the field of new electronic devices

汪  钢——宁波润华全芯微电子设备有限公司创始人

WANG Gang——Founder of Ningbo All-Semi Micro Electronics Equipment

Co.，Ltd

09:50-10:15

需求引领，技术创新，构建中国碳化硅产业新生态

Demand Leadership, Technological Innovation, Building a New Ecosystem for China’s Silicon Carbide Industry

李仕群——北京北方华创微电子装备有限公司行业总经理

LI Shiqun——Marketing General Manager of Beijing NAURA Microelectronics Equipment Co.,Ltd

10:15-10:40

化合物半导体异质集成晶圆键合技术与应用

Wafer bonding technology and application in heterogeneous integration of compound semiconductors

张洁琼——九峰山实验室键合工艺技术开发负责人

Zhang Jieqiong——Head of Bonding Technology Development at JFS Laboratory

10:40-10:55

茶歇 / Coffee Break

10:55-11:20

ULVAC面向化合物半导体的解决方案

ULVAC solutions for compound semiconductors

左  超——爱发科商贸（上海）有限公司 营业本部本部长

ZUO Chao——General Manager of Sales Department,  ULVAC (Shanghai) Trading Co., Ltd. 

11:20-11:45

化合物半导体电子束量测技术的机遇和挑战

Opportunities and Challenges of eBeam Metrology in Compound Semiconductor

雒晓军——东方晶源微电子科技(北京)股份有限公司副总裁

LUO Xiaojun——Vice President of Dongfang Jingyuan Electron Co., Ltd.

11:45-12:10

专用光学去噪声技术在wafer AOI的应用

The Application of Optical Noise Reduction Technology in wafer AOI

龙凤彩——珠海诚锋电子科技有限公司产品总监

LONG Fengcai——Product Director of Zhuhai Chengfeng Electronic Technology Co., LTD.

12:10-14:00

午餐 / Lunch

主持人

Moderator

赵  波 / ZHAO Bo

九峰山实验室工艺中心TD负责人

TD Manager of Process Center, JFS Laboratory

陈怡骏 / CHEN Yijun

SPTS Technologies Limited 技术经理

Technical Manager of SPTS Technologies Limited

14:00-14:25

激光微纳加工技术在碳化硅材料中的应用

Application of Laser Micro/Nano Processing Technology in Silicon Carbide Materials

黄  伟——华工激光精密事业群半导体面板事业部总监

HUANG Wei——BD Director of Semiconductor Panel at HGLaser Engineering Co,. Ltd.

14:25-14:50

应用于碳化硅等宽禁带材料的等离子体刻蚀和沉积工艺

Plasma Etch and Deposition Processes for SiC and other WBG Materials

陈怡骏——SPTS Technologies Limited 技术经理

CHEN Yijun——Technical Manager of SPTS Technologies Limited

14:50-15:15

九峰山实验室设备国产化验证方案

Equipment Localization Verification Programme of JFS Lab

赵  波——九峰山实验室工艺中心TD负责人

ZHAO Bo——TD Manager of Process Center, JFS Laboratory

15:15-15:40

基于MBE的化合物外延和界面钝化开发介绍

Introduction to Development of Compound Epitaxy and Interface Passivation Based on MBE

谢斌平——费勉仪器科技(上海)有限公司首席技术官

XIE Binping——CTO of Fermion instruments (Shanghai) Co., LTD.

15:40-15:55

茶歇 / Coffee Break

15:55-16:20

先进抛光技术助力8寸碳化硅量产

Advanced polishing technology helps mass production of 8-inch silicon carbide 

刘泳沣——北京特思迪半导体设备有限公司 创始人&CEO

LIU Yongfeng——Founder & CEO of Beijing TSD Semiconductor Equipment Co., Ltd.

16:20-16:45

激光能为我们做什么—激光在化合物半导体产业中的应用

What can laser help - laser applications in the compound semiconductor industry

王  爽——苏州德龙激光股份有限公司行业经理

WANG Shuang——Marketing Manager of Suzhou Delphi Laser Co., Ltd.

16:45-17:10

超快激光材料加工技术的机遇与挑战

Opportunities and Challenges in Ultrafast Laser Material Processing Technology

李赵青——武汉华日精密激光股份有限公司应用工艺部经理

LI Zhaoqing——Manager of the Application Process Department and the Director of Precision Micro-Nano Processing Research Laboratory at Wuhan Huari Precision Laser Co., Ltd

17:10-17:35

化合物半导体生产中的电镀工艺

Electroplating Process in Compound Semiconductor Production

印琼玲——新阳硅密（上海）半导体技术有限公司执行副董事长

YIN Qiongling——Executive Vice Chairwoman of Systech Technology Co., Limited

4月11日 / April 11

09:00-09:25

测试技术赋能存储产业高质量发展

Testing technology energize high-quality development of the storage industry

谢  伟——苏州欧康诺电子科技股份有限公司产品总监

XIE Wei——Product Engineering Director of Suzhou OKN technology CO.,Ltd

09:25-09:50

打造三代半导体制造关键设备，原子层沉积和离子注入

Building key equipment for wide bandgap semiconductor manufacturing, atomic layer deposition and ion implantation

陈祥龙——青岛四方思锐智能技术有限公司副总经理

CHEN Xianglong——Deputy General Manager of Sri Intellectual

09:50-10:15

车规级功率半导体塑封技术及未来趋势

Automotive power semiconductor EMC molding technology and future trends

曹  萍——卓尔半导体设备(苏州)有限公司总经理

CAO Ping——General Manager of Zhuoer Semiconductor Equipment (Suzhou) Co., Ltd

10:15-10:40

高精度MEMS光纤传感器在半导体设备及机器人上的应用

Application of high-precision MEMS fiber optic sensors in semiconductor equipment and robots

郭凉杰——上海拜安半导体有限公司总经理

GUO Liangjie——General Manager of BAIANTEK Limited

10:40-10:55

茶歇 / Coffee Break

10:55-11:20

先进封装良率提升解决方案/机遇与挑战

Advanced Packaging Yield Improvement Solutions/Opportunities and Challenges

张景南——南京屹立芯创半导体科技有限公司总经理

ZHANG Jingnan——General Manager of Elead Technology Co., Ltd.

11:20-11:45

二元气体浓度仪在半导体行业的应用

The application of binary gas concentration meters in the semiconductor industry

江晓松——上海先普气体技术有限公司 董事长兼总经理

JIANG Xiaosong——Chairman & General Manager of Shanghai Xianpu Gas Technology Co., Ltd.

11:45-12:10

半导体芯片制造缺陷检测技术及设备

Defect inspection technology and equipment in Semiconductor chip manufacturing

徐景瑞——中导光电设备股份有限公司高级副总裁

XU Jingrui——Senior VP of Zhongdao Optoelectronic Equipment Co., Ltd.