是德科技化合物半导体培训会（免费开放）

是德科技化合物半导体培训会

Keysight Training Session on Compound Semiconductor

时间：2024年4月8日 13:30-17:30

Time: April 8, 2024 13:30-17:30

地点：中国武汉光谷科技会展中心 • 三层 • 多功能厅3

Location: China Optics Valley Convention & Exhibition Center • 3rd Floor • 3F Multifunctional Hall 3

13:30-14:00

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14:00-15:00

化合物半导体器件建模主流方案

Compound Semiconductor Devices Modeling Solutions in the Industry

主讲人：高文明——是德科技器件模型应用工程师

Speaker: Wenming GAO——Application engineer for device modeling

摘要/ Abstract:

化合物半导体器件具有高饱和速度、高击穿电压、高载流子密度等优越性能，被广泛应用于高功率、高电压、高频率的应用领域。为了将化合物器件纳入电路设计，准确的电路模拟是必要的。本讲座主要针对目前主流的化合物半导体工艺类型介绍经验模型、物理模型和基于人工智能神经网络的模型，并根据其可能的应用场景介绍量测和建模的关键性挑战和目前业界的主流量测建模方法，帮助化合物代工厂向设计师提供业界最有竞争力的量测和模型方案。

Compound semiconductor devices possess superior performance characteristics such as high saturation speed, high breakdown voltage, and high carrier density, making them widely used in applications requiring high power, high voltage, and high frequency. In order to incorporate compound devices into circuit design, accurate circuit simulation is necessary. This lecture primarily focuses on introducing empirical models, physical models, and artificial intelligence neural network-based models for the current mainstream compound semiconductor processes. It also discusses the key challenges in measurement and modeling along with the mainstream measurement modeling methods currently employed in the industry based on their potential application scenarios. The aim is to assist compound foundries in providing designers with the most competitive measurement and modeling solutions available in the industry.

15:00-16:30

采用化合物半导体工艺进行电路与模组设计的主要流程

Circuit and module design flow exploration using compound semiconductor process

主讲人:   许玥——是德科技射频微波软件应用工程师

王晓霞——是德科技Foundry及射频前端行业客户成功经理

Speaker: Xu Yue——Application engineer for RFMW designs

Amanda Wang——Customer Success Manager for Foundry and RF front-end industry

摘要 / Abstract:

本讲座力图从设计师的角度，全面介绍采用化合物工艺PDK进行电路和模组设计，涵盖从电路到版图的全部流程。包括但不限于良率分析，电磁仿真，电热仿真，多工艺模组堆叠，以及结合Python在建模和自动化相关应用。同时还包括对于芯片设计数据及版本的管理。

针对流程中的关键设计，将会进行多个案例分享，从多个维度去了解芯片设计者对于PDK及其模型在精度，效率，兼容性，安全性的需求。提升芯片及模组设计的精度与效率。

The lecture aims to comprehensively introduce circuit and module design using compound process PDK from the perspective of designers, covering the entire process from circuit to layout. This includes but is not limited to yield analysis, electromagnetic simulation, thermal simulation, multi-process assembling, as well as modeling and automation applications combined with Python. It also includes management of chip design data and versions. Multiple case studies will be shared for key designs in the process, providing insights into the accuracy, efficiency, compatibility, and security requirements that chip designers have for PDK and its models. The goal is to enhance the precision and efficiency of chip and module design.

16:30-17:30

互动环节 / Interactive session